Design Rules for
Copper IMS Printed Circuits
Downloads
| Name | Type | Size | Download |
|---|---|---|---|
| Technology - Copper-IMS-Printed Circuits - Rev 240402(50,72 KB, PDF) | 51 KB | Download | |
| Standard Base Material(165,26 KB, PDF) | 165 KB | Download | |
| Stackup Copper Carrier Rev. 2.0(93,52 KB, PDF) | 94 KB | Download |
Design rules
| Options and Characteristics - Copper-IMS-Printed Circuits - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Quantity | 1 piece up to 1,0m² total area | from 1 piece to mass production |
| Layer quantity | 1 layer | up to 6 layers |
| Material thickness (1-layer) | 1,0 / 1,6 / 2,0mm | 0,80mm to 4,0mm |
| Material thickness (2-layers) | not possible | 1,8mm |
| Material thickness (4- to 6-layers) | not possible | 2,0mm to 4,0mm |
| Copper thickness (1- and 2-layers) | 35µm | 35µm, 70µm, 105µm |
| Copper thickness (4- to 6-layers) | not possible | 35µm, 70µm, 105µm |
| Dielectric thickness | 100µm | 60 to 200µm |
| Material colour | beige or brown prepreg / copper | beige or brown prepreg / copper |
| Base material type | copper / Isolation: FR4 Tg 130° C | copper / Isolation: FR4 Tg 170° C |
| Maximum operating temperature | ca. 100° C | ca. 150° C |
| Silk print layer | none, top | none, top, bottom, double sided |
| Solder mask colour | green, white, black, blue and red | green, white, black, blue, red and transparent (individual colours on exact colour value - RAL scale) |
| Silk print colour | white, black respectively on white solder mask | black, blue, yellow, red |
| Via-Filling (no copper lid) | not possible | possible |
| Electric test | included | finger-test or adapter |
| Plugging (with copper lid, e.g. for "via-in-pad technology" | not possible | possible |
| Peelable mask | not possible | top, bottom or double sided |
| Beveling | not possible | possible |
| Surface finish | immersion gold (ENIG) | immersion tin, immersion gold (ENIG or ENEPIG), OSP |
| Finger gold | not possible | not possible |
| Long term tempering | not possible | possible |
| Maximum copper-IMS-printed circuit board size 1 and 2 layers IMS-copper PCB | 270 x 430mm | 420 x 580 mm² |
| Maximum copper-IMS-printed circuit board size for copper-IMS multilayer PCBs | not possible | 230 x 360mm² |
| Minimum copper-IMS singulated circuit board size | 3cm², smaller can be calculated but will be panelized | >1cm² <3cm² on enquiry |
| Minimum copper-IMS circuit boar size in v-cut panels | not possible | <10x10mm² on enquiry |
| Minimum copper-IMS circuit boar size in routing panels | 10x10mm² / 1cm² | <5x5mm² on enquiry |
| Minimum copper-MS printed circuit board width | 5mm | <5mm on enquiry |
| Lead time options 1 layer copper-IMS printed circuits | 12WD | 5WD |
| Lead time options 2-ayers copper-IMS multilayer printed circuits | not possible | starting at 4WD |
| Lead time options 4- to 6 layers multilayer printed circuits | not possible | starting at 5WD |
| Routing | always | always |
| V-cut | possible | possible |
| Jump-v-cut | possible | possible |
| Punching | not possible | not possible |
| Counter-sink-holes | not possible | possible |
| Z-axis milling | not possible | possible |
| Aluminium-IMS special stack-up | not possible | possible |
| Panel Production - Copper-IMS Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| V-cut panel | not possible | possible |
| V-Cut - ALU routing panel (combination) | not possible | possible |
| Multi panels (more than one layout per panel) | possible | possible |
| Panel setup (chosen by LeitOn) | possible | possible |
| Panel setup (according to drawing) | possible | possible |
| PTH-drills (plated drills) - Copper-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest drill 35µm (final diameter) | PTH not possible (only 1-layer) | 0,10mm |
| Smallest drill 70µm (final diameter) | PTH not possible (only 1-layer) | 0,30mm |
| Smallest drill 105µm (final diameter) | PTH not possible (only 1-layer) | 0,30mm |
| Smallest annular ring 35µm | PTH not possible (only 1-layer) | 0,20mm |
| Smallest annular ring 70µm | PTH not possible (only 1-layer) | 0,20mm |
| Smallest annular ring 105µm | PTH not possible (only 1-layer) | 0,20mm |
| Possibel drill diameters | PTH not possible (only 1-layer) | 0,30mm to 2,2mm in 0,05mm steps |
| Drills >5,5mm | PTH not possible (only 1-layer) | routed |
| Smallest drill distance 1-layer copper-IMS-circuits (drill edge to drill edge) | PTH not possible (only 1-layer) | 0,40mm |
| Smallest drill distance 2-layers copper-IMS-circuits (drill edge to drill edge) | PTH not possible (only 1-layer) | 0,80mm |
| Intersecting drills | PTH not possible (only 1-layer) | not possible, will be routed |
| Half-open PTH on PCB edge | PTH not possible (only 1-layer) | not possible |
| NPTH-drills (non-plated drills) - Copper-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smalles drill size (final diameter) | 1,0mm | 0,30mm |
| Possible drill sizes | 1,0mm to 5,5mm in 0,05mm steps | 0,30mm to 5,5mm in 0,05mm steps |
| Copper clearance / distance to copper | 0,20mm | 0,20mm |
| Drills >5,5mm | routed | routed |
| Minimum drill-to-edge distance | 0,50mm | 0,50mm |
| Smallest drill distance 1-layer copper-IMS-circuits (drill edge to drill edge) | 0,40mm | 0,40mm |
| Smallest drill distance 2-layers copper-IMS-circuits (drill edge to drill edge) | not possible | 0,70mm |
| Intersecting drills | not possible, will be routed | not possible, will be routed |
| NPTH drills in copper area (without clearance) | not possible (will be cleared from copper by min. 0,2mm) | on explicit requirement only |
| Blind Vias - Copper-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest blind via (final diameter) | not possible | 0,30mm |
| Smallest Aspect-Ratio | not possible | 1:1 |
| Smallest annular ring | not possible | 0,10mm |
| Buried Vias - Copper-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest buried via (final diameter) | not possible | possible |
| Routing (non-plated) - Copper-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Inner routing NPTH | possible | possible |
| Smallest inner routing NPTH | 2,0mm | 1,0mm |
| Available routing diameters NPTH | 2,0mm | 2,0mm |
| Smallest radius (inner corners) NPTH | 1,0mm | 0,5mm |
| Routing (plated) - Copper-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Inner routing PTH | not possible | possible |
| Smallest PTH inner routing (final diameter) | not possible | 2,0mm |
| Edge plating (outer edge) | not possible | not possible |
| Special routing paths with plating (inner) | not possible | possible |
| Available routing diameters PTH (final diameter) | not possible | 2,0mm |
| Smallest radius (inner corner, final) PTH | not possible | 1,0mm |
| Smallest annular ring | not possible | 0,20mm |
| Copper Layers (outer) - Copper-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest trace 35µm | 0,15mm | 0,10mm |
| Smallest trace 70µm | not possible | 0,15mm |
| Smallest trace 105µm | not possible | 0,40mm |
| Smallest trace-to-trace distance 35µm | 0,15mm | 0,10mm |
| Smallest trace-to-trace distance 70µm | not possible | 0,15mm |
| Smallest trace-to-trace distance 105µm | not possible | 0,40mm |
| Smallest drill pad | drill siez +0,30mm | drill size +0,20mm |
| Smallest copper clearance to inner routing | 0,30mm | 0,25mm |
| Smallest copper clearance to board edge (routing) | 0,30mm | 0,25mm |
| Smallest copper clearance to board edge (v-cut) | not possible | 0,50mm |
| Copper Layers (inner) - Copper-IMS-Multilayer Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest trace 35µm | not possible | 0,10mm |
| Smallest trace 70µm | not possible | 0,15mm |
| Smallest trace 105µm | not possible | not possible |
| Smallest trace-to-trace distance 35µm | not possible | 0,10mm |
| Smallest trace-to-trace distance 70µm | not possible | 0,20mm |
| Smallest trace-to-trace distance 105µm | not possible | not possible |
| Smallest drill-pad diameter | not possible | 0,60mm |
| Smallest copper clearance to outer edges (routed) | not possible | 0,30mm |
| Smallest copper clearance to inner edges (routed) | not possible | 0,30mm |
| Smallest copper clearance to drills | not possible | 0,30mm |
| Solder Mask - Aluminium-IMS-Multilayer Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
 Smallest solder mask web (straight) |
0,12mm | 0,10mm |
| Smallest solder mask web (straight) |
0,15mm | 0,15mm |
 Smallest solder mask web (round) |
0,075mm | 0,05mm |
 smallest solder maks size around copper |
0,075mm | <0mm |
| Smallest text lines | 0,25mm | 0,20mm |
| Silk Print - Copper-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest lines | 0,20mm | 0,15mm |
| Smallest distance between lines | 0,20mm | 0,15mm |
| Minimum clearance to copper pads | 0,20mm | 0,15mm |
| Carbon Print - Copper-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest pad-to-pad distance | not possible | 0,30mm |
| Tolerances, Values, Marks & Norms - Copper-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Max. offset drill centre to centre of reference | 0,10mm | 0,05mm |
| Max. offset soldermask / copper structures | 0,15mm | 0,075mm |
| Finished drill sizes PTH (<=0,50mm) | not possible | -0/+0,10 |
| Finished drill sizes PTH (0,55 to 3mm) | not possible | -0/+0,10mm |
| Finished drill sizes PTH (>3mm) | not possible | -0/+0,10mm |
| Finished drill sizes NPTH (up to 6mm) | -0,05/+0,20mm | -0/+0,10mm |
| Finished drill sizes NPTH (>6mm) | -0,05/+0,20mm | -0/+0,10mm |
| Outline | +/-0,20mm | +/-0,10mm |
| Max. offset outline/copper structures | +/-0,20mm | +/-0,10mm |
| V-cut depth | not possible | +/-0,20mm |
| Z-axis milling | not possible | +/-0,20mm |
| V-Cut position to copper structures | not possible | +/-0,15mm |
| Etch tolerance copper thickness 35µm | +0/-0,03mm | +0/-0,03mm |
| Etch tolerance copper thickness 70µm | +0/-0,05mm | +0/-0,05mm |
| Etch tolerance copper thickness 105µm | not possible | +0/-0,08mm |
| Material thickness tolerances | +/-10% | differs, please enquire |
| Copper thickness tolerances | +20% / -15% | +/-10% |
| Immersion tin thickness | >1µm | >1µm |
| HAL lead free thickness | >= 8- bis 10µm, edges >0,5µm | >= 8- bis 10µm, edges >0,5µm |
| HAL lead thickness | not possible | not possible |
| Immersion gold for gold-wire bonding (nickel thickness), ENEPIG | not possible | 3µm to 6µm |
| Immersion gold for gold-wire bonding (gold thickness), ENEPIG | not possible | 0,025µm to 0,05 µm |
| Immersion gold for aluminum-wire bonding (nickel thickness), ENIG | 3µm to 6µm | 3µm to 6µm |
| Immersion gold for aluminum-wire bonding (gold thickness), ENIG | 0,05µm to 0,12 µm | 0,05µm to 0,12 µm |
| Electrolytic connector gold - soft, bonding possible (nickel thickness) | not possible | not possible |
| Electrolytic connector gold - soft, bonding possible (gold thickness) | not possible | not possible |
| Electrolytic connector gold - hard, bonding NOT possible (nickel thickness) | not possible | not possible |
| Electrolytic connector gold - hard, bonding NOT possible (gold thickness) | not possible | not possible |
| Wet solder laquer thickness | >15µm | >15µm |
| Copper thickness in plated hole, traces 35µm | minimum 18µm | minimum 20µm |
| Copper thickness in plated hole, traces 70µm | not possible | minimum 20µm |
| Copper thickness in plated hole, traces 105 to 210µm | not possible | minimum 20µm |
| hickness in plated hole, traces 280 to 400µm | not possible | minimum 20µm |
| Winding | max. 1% | max. 0,5% |
| Warping | max. 1% | max. 0,5% |
| Beveling angle | not possible | not possible |
| Base materials RoHS-compliance | yes, always | yes, always |
| Surface finish RoHS-compiance | yes, always | always, unless "HAL lead" is explicitly required |
| IPC-norm | IPC-A-600 - Class 2, if applicable | IPC-A-600 - Class 1, 2 or 3, if applicable |
| UL-approval of printed circuits (UL number, logo, date code) | not possible | UL94V0 possible |
| UL-approved base material | yes, always | possible |
| Insertion of date code | possible, please mention in enquiry | possible, please mention in enquiry |
| Insertion of supplier logo (LeitOn) | possible, please mention in enquiry | possible, please mention in enquiry |
| DIN EN ISO 9001 certification | yes | yes |
| DIN EN ISO 9001 certification of printed circuit board production | no | possible |
| DIN EN ISO 14001 certification of printed circuit board production | no | possible |
| DIN EN ISO 16949 certification of printed circuit board production | no | possible |
Climate-neutral operation
since 2021
since 2021
- CO2 neutral through compensation
- Circuit boards – green on the outside, also on the inside
Member of the Fachverband Elektronik-Design
- Expertise through active exchange
- Expertise through training and further education
ISO tested by the most renowned auditor in Germany
- ISO 9001:2015 Quality Management
- ISO 14001:2015 Environmental Management
UL approvals for various types of circuit boards
- UL for rigid FR4 PCBs
- UL for flexible circuit boards
- UL for aluminum IMS boards
